Tessera, Inc v. Micron Technology Inc et al, No. 2:05-cv-00094 (E.D. Tex. Mar. 22, 2006)

From the Opinion

The passage below is extracted verbatim from the opening of the document. It has not been editorially summarized — consult the full opinion for the court's complete reasoning.

This claim construction Opinion construes terms in U.S. Patent No. 5,679,977 (“the ‘977 patent); 5,852,326 (“the ‘326 patent”); 6,133,627 (“the ‘627 patent”); 6,433,419 (“the ‘419 patent”); 6,465,893 (“the ‘893 patent”). Background The patents in suit collectively deal with semiconduc tor packaging, the technolog y that protects delicate semiconductor chips (“chips”) from the outside environment while allowing the chips to connect to other semiconductor chips and with the devices they support, such as cell phones or computers.