Ocean Semiconductor LLC v. Huawei Device USA, Inc. et al, No. 4:20-cv-00991 (E.D. Tex. Feb. 8, 2022)

From the Opinion

The passage below is extracted verbatim from the opening of the document. It has not been editorially summarized — consult the full opinion for the court's complete reasoning.

Before the Court are Plaintiff Ocean Semic onductor LLC’s (“Plaintiff” or “Ocean”) Opening Claim Construction Brie f (Dkt. #26), Defendants Huawei Device USA, Inc., Huawei Device Co., Ltd., and HiSilicon Technologies Co., Ltd’s (“Defendants” or collectively “Huawei”) Responsive Claim Construction Brief (Dkt. #33), and Plaintiff’s Reply Claim Construction Brief (Dkt. #34).1 Also before the Court is the parties’ December 23, 2021 Joint Claim Construction and Prehearing Statement (Dkt. #36).