Semcon IP Inc. v. Huawei Device USA Inc. et al, No. 2:16-cv-00437 (E.D. Tex. July 12, 2017)
From the Opinion
The passage below is extracted verbatim from the opening of the document. It has not been editorially summarized — consult the full opinion for the court's complete reasoning.
Before the Court is the opening claim construction brief of Semcon IP Inc. (“Plaintiff”) (Dkt. No. 120, filed on April 26, 2017),1 the response of Texas Instruments Incorporated, Mediatek Inc., Mediatek USA Inc., STMicroelectronics, Inc., ZTE (US A) Inc., ZTE (TX), Inc., Huawei Device USA Inc., Huawei Technologies USA Inc., and Huawei Technologies Co., Ltd. (collectively “Defendants”) (Dkt. No. 138, filed on May 17, 2017), and the reply of Plaintiff (Dkt. No. 145, filed on May 25, 2017).
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