Micron Technology, Inc. vs Tessera, Inc., No. 2:05-cv-00319 (E.D. Tex. July 13, 2006)

From the Opinion

The passage below is extracted verbatim from the opening of the document. It has not been editorially summarized — consult the full opinion for the court's complete reasoning.

This claim construction opinion constr ues terms in U.S. Patent Nos. 4,992,849 (“the ‘849 patent”), 5,107,328 (“the ‘328 patent ”), and Re. 36,325 (“the ‘325 patent”). Plaintiffs, Micron Technology, Inc. a nd Micron Semiconductor Products, Inc. (collectively “Micron”), have asserted seve ral other patents against Defendant, Tessera, Inc. (“Tessera”), in this lawsuit, but only claim language from the ‘849, ‘325, and ‘328 patents remains in dispute. The Patents The patents in suit generally deal with microchip packaging.